DG News Service - Five chip makers, including Intel, IBM, Samsung Electronics, GlobalFoundries and Taiwan Semiconductor Manufacturing Co. have committed investment of US$4.4 billion in research and development in the state of New York over the next five years, to develop new 450-millimeter chip wafer technology, the state's governor Andrew M. Cuomo said on Tuesday.
New York secured the investment in competition with other locations worldwide, Cuomo said in a speech that was also webcast.
IBM has committed $3.6 billion of the total investment to work on next generations of computer chips, including those using 22-nanometers and 14-nanometers process technology, said John Kelly, senior vice president and director of IBM Research.
Since 2000, IBM has invested more than $10 billion in New York state, its largest investment anywhere in the world, Kelly said.
The transition from 300mm to 450mm wafers will require unprecedented industry-wide collaboration, and the New York project is critical for the new consortium, called Global 450, said Brian Krzanich, senior vice president and general manager of manufacturing and supply chain at Intel.
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